NexPCB Blog

Everything you need to get started to manufacture awesome IoT products. PCB, PCBA, EMS, SMT, Supply Chain and Sourcing.

Featured News · Jun 11, 2015
ee

PCB Routing Requirements

Detail
ee

Design of a PCB Hole

1. Design of Through Hole

Jun 05, 2015
ee

Trace Impedance

Care should be taken to distinguish between single ended and differential trace impedance. High speed single ended signa...

Apr 21, 2015
ee

Bonding Pad Design Ⅰ

1.Design of bonding pad with through hole cartridge components a) The diameter design of components plug-in holes is acc...

Apr 10, 2015
ee

Bonding Pad Design Ⅱ

SMD component bonding pad design 2.1 Passive device pad design 2.1.1 Rectangle component pad design Shapes of resistor a...

Apr 09, 2015
soldermask-silkscreen-printed-circuit-board-concepts-2
ee

Screen Printing Design

General requirements for screen printing 1. The line weight of screen printing should be greater than 6 mil, and make su...

Apr 09, 2015

6 Suggestions for Engineers of Components Selection

There was a common phenomenon existing in products technical condition in some corporations: all developers condemned th...

Apr 09, 2015
Previous 11 / 10 Next

Bring NexPCB Expertise to Your Business

Lorem ipsum dolor sit amet, consectetuer adipiscing elit. Aenean commodo ligula eget dolor. Aenean massa. Cum sociis natoque penatibus et magnis dis parturient montes.